Description
Examine internal solder joints and bonds in advanced technology packages — BGAs,μBGAs, flip-chips, ICs and other complex components — that cannot be verified by visual inspection. At the same time, obtain precise images from soft materials — molded plastics and encapsulants — as easily as from denser materials.
For laboratory and failure analysis applications, JewelBox systems deliver superior image quality with excellent resolution and sensitivity. On the production line, JewelBox systems support fast, precise inspection of components and assemblies.
Specification 90T
JewelBox-90T Specifications
■ Operating voltage:
120v/60 hz or 220v/50 hz
■ Anode voltage: 90kV (adjustable)
■ Anode current: 100 μAmps
(adjustable)
■ Resolution: 100 line pairs/mm
■ Magnification: variable 7x up
to 2000x
■ Focal spot size: 5 to 7 micron
■ Nominal exterior dimensions: 35 1/8”W x 43 1/8”D x 72 3/4”H
■ Inspection compartment dimensions: 29 3/4”W x 30 3/4”D
x 23 3/4”H
■ Computer Cart included
■ Manipulator: five-axis joystick positioner
■ GTI-5000 Image Processing software includes PC, monitor & printer
■ CE approved
Specification 70T
JewelBox-70T Specifications
■ Operating voltage: 120v/60 hz or
220v/50hz
■ Anode voltage: 80kV (adjustable)
■ Anode current: 100 μAmps (adjustable)
■ Resolution: 100 line pairs/mm
■ Magnification: variable 7x up to 2000x
■ Focal spot size: 10 micron
■ Nominal exterior dimensions:
35 1/8”W x 43 1/8”D x 64 1/4”H
■ Inspection compartment dimensions:
29 3/4”W x 30 3/4”D x 23 3/4”H
■ Computer Cart included
■ Manipulator: five-axis joystick positioner
■ GTI-5000 Image Processing software
includes PC, monitor and printer
■ CE approved
